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Laser marking equipment for substrates [Case study and problem-solving collection available now!]

Laser marking × image processing, which means high precision and high operability. This is a laser marker made by a manufacturer of appearance inspection equipment.

■ I want to use a laser marker to build a traceability system. ■ I want to control the printing position with micron-level precision. ■ I want to eliminate misprints caused by operational errors. ■ Double-sided printing takes too much time. ⇒ Do you have such concerns? Our product comes standard with a camera, lighting, and appearance inspection software, allowing for high-precision correction of the printing position and printing exactly where intended. Not only can it print, but it can also capture the printed content with a camera and log it, as well as confirm code readings, enabling high-value-added operations! It helps prevent double printing and operational errors in the insertion direction of the workpiece, improving yield. 【Features】 ♦ Equipped with Panasonic laser units ♦ Position correction through image processing allows for position control below 80µm ♦ The movable laser head enables high-definition printing at any position on the substrate ♦ Reads pre-prepared files from servers, allowing for changes in printing content for each substrate ♦ Simultaneous double-sided printing is possible ♦ Offers CO2 lasers, fiber lasers, and UV lasers ♦ There is also a model compatible with large-sized substrates.

  • Laser marker
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InnoLas laser marking device for wafers

The laser light source developed by InnoLas for wafer marking achieves a low running cost that can be maintained for about 10 years (based on actual data).

Markable wafer materials: Silicon (Si), Germanium (Ge), Sapphire (Al2O3), Lithium Tantalate (LiTaO3), Lithium Niobate (LiNbO3), Gallium Arsenide (GaAs), Gallium Nitride (GaN), Silicon Carbide (SiC), Indium Phosphide (InP), glass, etc. To accommodate various wafer materials, we offer the following lasers: - UV (355nm), Green (532nm), IR (1064nm), IR, Carbon Dioxide (10.6μm). Options: - Motorized Beam Expander (MBE): Adjusts beam diameter, focal position, etc., according to recipe data. - Power Consumption Display Panel (DCM): Aggregates and displays line power supply, Galvo voltage/temperature, compressed air pressure, etc., in one location. - Additionally, we offer a variety of user-friendly options.

  • Laser marker
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